China Molybdenum Target Suppliers - High-Purity Mo Sputter Coating Factory for PVD Applications
High-temperature stability and mechanical properties
Ultra-high melting point: 2623°C
Can maintain structural stability in high-temperature sputtering environments (300~800°C) and has strong resistance to thermal deformation.
High-temperature strength
Still maintains high hardness and creep resistance at high temperatures, ensuring that the target material does not crack or deform during long-term processes.
Thermal expansion coefficient
4.8×10⁻⁶/K provides good thermal compatibility with silicon and glass substrates, reducing delamination or cracking caused by thermal stress of the film.
Conductivity and thermal management performance
High conductivity
Improve sputtering efficiency and reduce process energy consumption.
High thermal conductivity
Quickly conducts sputtering heat to prevent target cracking or droplet splashing caused by local overheating, and ensures the uniformity of the film layer.
Characteristics of Thin Film Deposition
Low sputtering rate
High power excitation is required, but the sedimentary film layer is dense and the adhesion is strong.
High density
Reduce porosity and defects during sputtering, improve film purity and compactness.
Controllable grain size
Achieve fine grain structure through process optimization, reduce sputtering particles, and improve the surface finish of the film layer.
Chemical stability and multifunctionality
Corrosion resistance
Resistant to most acids, alkalis and process gases (such as O₂, N₂), suitable for reactive sputtering (such as deposited MoO₃, MoN).
Low oxygen affinity
Not easy to oxidize at high temperature, maintain the characteristics of high-purity metal film (need to control the oxygen content of the cavity).
Frequently Asked Questions (FAQ)
Q1: How does the melting point of Molybdenum targets benefit high-temperature sputtering?
Molybdenum has an ultra-high melting point of 2623°C, allowing it to maintain structural integrity and resist thermal deformation even under intense sputtering conditions ranging from 300°C to 800°C.
Q2: Why is the thermal expansion coefficient of Molybdenum targets important?
With a thermal expansion coefficient of 4.8×10⁻⁶/K, Molybdenum matches closely with silicon and glass substrates. This minimizes thermal stress and prevents the deposited thin films from peeling, cracking, or delaminating.
Q3: How does high thermal conductivity prevent target cracking?
High thermal conductivity ensures that heat generated during the sputtering process is rapidly dissipated. This prevents localized hotspots that could cause thermal stress, target cracking, or droplet splashing.
Q4: Does a low sputtering rate affect the quality of the deposited thin film?
While a low sputtering rate requires higher power excitation, it results in a much denser deposited film layer with superior adhesion and fewer structural defects.
Q5: Can Molybdenum targets be used for reactive sputtering processes?
Yes. Because Molybdenum is highly resistant to corrosive process gases like Oxygen (O₂) and Nitrogen (N₂), it is ideal for reactive sputtering to deposit compounds such as MoO₃ and MoN.
Q6: What precautions are needed regarding Molybdenum's low oxygen affinity?
Molybdenum is highly resistant to oxidation, but to maintain the characteristics of a high-purity metal film, it is essential to strictly control the residual oxygen content within the vacuum chamber during deposition.