Customizable CrSi Alloy Targets from China Suppliers | High-Purity Sputtering Targets for PVD Applications - Factory Direct
CrSi thin films have a wide resistivity range, which allows for high-precision resistor preparation through composition adjustment.
Maintains stable electrical properties in high-temperature environments (≤800°C), making it suitable for high-temperature devices.
Strong bonding with ceramic and silicon substrates, and resistance to acidic and oxidative environmental corrosion.
High density and low porosity ensure uniform and consistent sputtering film composition.
High purity (≥99.9%) and low impurity content (oxygen content ≤600 ppm) reduce film formation defects.
The crystalline/amorphous structure of the thin film can be adjusted through process parameters to adapt to different application needs.
Can be deposited at ≤200°C, compatible with temperature-sensitive silicon-based semiconductor processes.
Compatible with dry/wet etching processes with high graphic accuracy for micromachining.
Free of contaminating elements (e.g., sodium, potassium), meeting the requirements of integrated circuit manufacturing.
What are the main functional characteristics of CrSi thin films?
CrSi thin films feature controllable resistance characteristics for high-precision resistors, high thermal stability in environments up to 800°C, and strong adhesion and corrosion resistance on ceramic and silicon substrates.
How does the sputtering performance of these thin films minimize defects?
The sputtering process achieves low defects by utilizing high purity levels (≥99.9%) and keeping impurity contents low, such as maintaining oxygen levels at or below 600 ppm.
At what temperatures can the CrSi thin film deposition process be performed?
It supports low-temperature film deposition at temperatures ≤200°C, making it highly compatible with temperature-sensitive silicon-based semiconductor processes.
Are CrSi thin films compatible with semiconductor manufacturing standards?
Yes, they are free of contaminating elements like sodium and potassium, ensuring they meet the strict cleanliness and integration requirements of integrated circuit manufacturing.
What options are available for etching and structuring these thin films?
They are friendly to both dry and wet etching processes, providing high graphic accuracy suitable for precise micromachining applications.