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High-Purity Alumina Ceramic Targets from China Suppliers - Leading Factory for PVD Applications

Alumina ceramic targets are high-purity sputtering targets made from alumina (Al₂O₃) with a purity level typically exceeding 99.9%. These targets are produced by a combination of advanced powder metallurgy techniques and high-temperature sintering processes. Designed for physical vapor deposition (PVD) applications, such as magnetron sputtering and pulsed laser deposition, our alumina ceramic targets stand out due to their remarkable insulating properties, chemical inertness, and exceptional hardness. As one of the leading suppliers in China, our factory ensures that these targets meet the stringent requirements of industries including semiconductor insulation, optical coatings, and wear-resistant applications. Experience top-quality performance and reliability with our alumina ceramic targets, perfect for enhancing your production processes

    Film properties
    High insulation
    The prepared alumina film has extremely high resistivity (>10¹⁴ Ω·cm) and dielectric strength (~10 MV/cm), making it an ideal material for insulation and dielectric layers.
    High hardness and wear resistance
    The extremely high hardness of the film (9 on the Mohs scale, second only to diamond) can significantly enhance the scratch and wear resistance of the device surface.
    Excellent chemical stability
    Extremely resistant to most acids, alkalis, and solvents, with excellent corrosion resistance and stability at high temperatures.
    Sputtering and Film Formation Properties
    High Purity and Consistency
    Ultra-high purity (≥99.9%) and strict composition control ensure stable film performance and avoid electrical or optical defects caused by impurity introduction.
    Dense and uniform film formation
    High target density (≥3.6 g/cm³) and uniform grain size enable high-quality film deposition with low defects and good thickness uniformity (inhomogeneity ≤5%).
    Process stability
    The ceramic structure is stable, not prone to cracking or powder loss during long-term sputtering, and has a long service life.
    Compatibility of Chemistry and Technology
    Excellent thermal stability
    The melting point is extremely high (2054°C), and the prepared films can work in high-temperature environments without degradation.
    Wide Gas Compatibility
    Sputtering in inert gas (Ar), reactive gas (O₂), or mixed gas environments with a wide process window.
    Good Adhesion
    Good adhesion to a wide range of substrates (silicon wafers, glass, metals, etc.) and can be used as a functional or protective layer.
    Frequently Asked Questions
    Q: What is the electrical insulation capacity of the prepared alumina film?
    The prepared alumina film features high insulation with extremely high resistivity (>10¹⁴ Ω·cm) and dielectric strength (~10 MV/cm), making it an ideal material for insulation and dielectric layers.
    Q: How hard is the alumina film, and does it provide wear resistance?
    The film has an extremely high hardness of 9 on the Mohs scale (second only to diamond), which significantly enhances the scratch and wear resistance of the device surface.
    Q: What is the deposition uniformity and quality of the film?
    With a high target density (≥3.6 g/cm³) and uniform grain size, the film achieves dense and uniform deposition with low defects and a thickness uniformity inhomogeneity of ≤5%.
    Q: Can the alumina film withstand high temperature and corrosive environments?
    Yes, the film has a melting point of 2054°C, allowing it to work in high-temperature environments. It also exhibits excellent chemical stability, being highly resistant to most acids, alkalis, and solvents.
    Q: What substrates and gases are compatible with the sputtering process?
    It supports sputtering in inert gas (Ar), reactive gas (O₂), or mixed gas environments, and exhibits good adhesion to a wide range of substrates including silicon wafers, glass, and metals.