High-Purity Alumina Ceramic Targets from China Suppliers | Top Factory for PVD Applications
Film properties
High insulation
The prepared alumina film has extremely high resistivity (>10¹⁴ Ω·cm) and dielectric strength (~10 MV/cm), making it an ideal material for insulation and dielectric layers.
High hardness and wear resistance
The extremely high hardness of the film (9 on the Mohs scale, second only to diamond) can significantly enhance the scratch and wear resistance of the device surface.
Excellent chemical stability
Extremely resistant to most acids, alkalis, and solvents, with excellent corrosion resistance and stability at high temperatures.
Sputtering and Film Formation Properties
High Purity and Consistency
Ultra-high purity (≥99.9%) and strict composition control ensure stable film performance and avoid electrical or optical defects caused by impurity introduction.
Dense and uniform film formation
High target density (≥3.6 g/cm³) and uniform grain size enable high-quality film deposition with low defects and good thickness uniformity (inhomogeneity ≤5%).
Process stability
The ceramic structure is stable, not prone to cracking or powder loss during long-term sputtering, and has a long service life.
Compatibility of Chemistry and Technology
Excellent thermal stability
The melting point is extremely high (2054°C), and the prepared films can work in high-temperature environments without degradation.
Wide Gas Compatibility
Sputtering in inert gas (Ar), reactive gas (O₂), or mixed gas environments with a wide process window.
Good Adhesion
Good adhesion to a wide range of substrates (silicon wafers, glass, metals, etc.) and can be used as a functional or protective layer.
Frequently Asked Questions
Q1: What are the primary insulating properties of the alumina film?
A: The prepared alumina film features an extremely high resistivity of over 10¹⁴ Ω·cm and a dielectric strength of approximately 10 MV/cm, making it an exceptional option for dielectric and insulating layers.
Q2: How does the hardness of the alumina film compare to other materials?
A: The alumina film registers a 9 on the Mohs scale, which is second only to diamond. This extreme hardness provides superior scratch and wear resistance for device surfaces.
Q3: Why is the target density of the alumina sputtering material important?
A: A high target density (≥3.6 g/cm³) ensures dense and uniform film deposition with minimal defects and excellent thickness uniformity, keeping inhomogeneity at or below 5%.
Q4: Can alumina films endure high-temperature operations?
A: Yes. Alumina has an extremely high melting point of 2054°C, which gives the deposited films outstanding thermal stability, allowing them to function in high-temperature environments without degradation.
Q5: Which substrates are compatible with alumina film deposition?
A: Alumina films exhibit excellent adhesion properties across a wide variety of substrates, including silicon wafers, glass, and metals, rendering them suitable for diverse protective or functional applications.