High-Purity Molybdenum Target for Sputter Coating - China Suppliers & Factory
High-temperature stability and mechanical properties
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Ultra-high melting point: 2623°C, which can maintain structural stability in high-temperature sputtering environment (300~800°C) and has strong resistance to thermal deformation;
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High-temperature strength: It still maintains high hardness and creep resistance at high temperatures, ensuring that the target material does not crack or deform during long-term processes;
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Thermal expansion coefficient (4.8×10⁻⁶/K): Good thermal compatibility with silicon and glass substrates, reducing delamination or cracking caused by thermal stress of the film;
Conductivity and thermal management performance
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High conductivity: Improve sputtering efficiency and reduce process energy consumption;
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High thermal conductivity: Quickly conducts sputtering heat to prevent target cracking or droplet splashing caused by local overheating, and ensures the uniformity of the film layer;
Characteristics of Thin Film Deposition
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Low sputtering rate: High power excitation is required, but the sedimentary film layer is dense and the adhesion is strong;
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High density: Reduce porosity and defects during sputtering, improve film purity and compactness;
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Controllable grain size: Achieve fine grain structure through process optimization, reduce sputtering particles, and improve the surface finish of the film layer;
Chemical stability and multifunctionality
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Corrosion resistance: Resistant to most acids, alkalis and process gases (such as O₂, N₂), suitable for reactive sputtering (such as deposited MoO₃, MoN);
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Low oxygen affinity: Not easy to oxidize at high temperature, maintain the characteristics of high-purity metal film (need to control the oxygen content of the cavity);
Frequently Asked Questions
What is the thermal stability and melting point of Molybdenum sputtering targets?
Molybdenum sputtering targets feature an ultra-high melting point of 2623°C. This allows them to maintain excellent structural stability and resist thermal deformation in high-temperature sputtering environments ranging from 300°C to 800°C.
How does the thermal expansion coefficient of Molybdenum benefit thin film deposition?
Molybdenum has a low thermal expansion coefficient of 4.8×10⁻⁶/K. This provides superior thermal compatibility with silicon and glass substrates, effectively reducing the risk of film delamination or cracking caused by thermal stress.
Why is high thermal conductivity critical for sputtering targets?
High thermal conductivity ensures that sputtering heat is dissipated rapidly. This prevents local overheating, which can cause target cracking or droplet splashing, and guarantees the overall uniformity of the deposited film layer.
What are the advantages of low sputtering rate and high density in Molybdenum targets?
Although a low sputtering rate requires high-power excitation, it produces a highly dense sedimentary film layer with strong substrate adhesion. The high density of the target also reduces porosity and defects, improving film purity.
How does grain size control improve the surface finish of the film?
By optimizing the manufacturing process, the grain size of the Molybdenum target can be controlled to achieve a fine grain structure. This minimizes the generation of sputtering particles and significantly enhances the surface finish of the film.
Is Molybdenum chemically stable during reactive sputtering?
Yes, Molybdenum exhibits high corrosion resistance against most acids, alkalis, and process gases like Oxygen (O₂) and Nitrogen (N₂). This makes it ideal for reactive sputtering to deposit compounds such as MoO₃ and MoN.