High-Purity Si Al Slug - China Suppliers and Factory for Aluminum-Silicon Alloy Granules
As a raw material for high-silicon aluminum alloys (such as Si content of more than 30%), it is used to prepare electronic packaging substrates, CPU heat dissipation covers, and power module substrates.
Low CTE matching silicon chip to avoid thermal cycle failure; High thermal conductivity and rapid heat export; Lightweight (only 1/3 the density of copper) for aerospace electronics systems.
Molding by powder metallurgy or vacuum hot pressing to ensure low porosity and high density.
They serve as essential raw materials for high-silicon aluminum alloys, which are widely used to manufacture electronic packaging substrates, CPU heat dissipation covers, and power module substrates.
A low Coefficient of Thermal Expansion (CTE) closely matches that of the silicon chip, preventing thermal cycle failure caused by thermal expansion mismatches during operation.
These materials are highly lightweight, with a density that is only one-third (1/3) of copper, making them ideal for weight-sensitive aerospace electronic systems.
They support advanced processing methods such as powder metallurgy and vacuum hot pressing, which ensure low porosity and high density in the finished components.
They are typically used for high-silicon aluminum alloys with a silicon (Si) content exceeding 30%.