High-Purity Si Al Slug Suppliers in China - Precision Aluminum-Silicon Alloy Factory
As a raw material for high-silicon aluminum alloys (such as Si content of more than 30%), it is used to prepare electronic packaging substrates, CPU heat dissipation covers, and power module substrates.
Low CTE matching silicon chip to avoid thermal cycle failure; High thermal conductivity and rapid heat export; Lightweight (only 1/3 the density of copper) for aerospace electronics systems.
Molding by powder metallurgy or vacuum hot pressing to ensure low porosity and high density.
They are used as raw materials for high-silicon aluminum alloys (with a silicon content exceeding 30%) to prepare electronic packaging substrates, CPU heat dissipation covers, and power module substrates.
A low Coefficient of Thermal Expansion (CTE) matches the silicon chip, which helps prevent thermal cycle failure during temperature fluctuations.
These materials are lightweight, with a density that is only 1/3 of copper, making them ideal for weight-sensitive aerospace electronics systems while still offering high thermal conductivity.
They support molding processes such as powder metallurgy and vacuum hot pressing, which ensure low porosity and high density in the final product.
The high thermal conductivity of these materials allows for rapid heat export, which protects sensitive electronics from overheating.