High-Purity Si Al Slug Suppliers in China - Precision Aluminum-Silicon Alloy Factory for Electronics and Coatings
As a raw material for high-silicon aluminum alloys (such as Si content of more than 30%), it is used to prepare electronic packaging substrates, CPU heat dissipation covers, and power module substrates.
Low CTE matching silicon chip to avoid thermal cycle failure; High thermal conductivity and rapid heat export; Lightweight (only 1/3 the density of copper) for aerospace electronics systems.
Molding by powder metallurgy or vacuum hot pressing to ensure low porosity and high density.
They serve as essential raw materials for high-silicon aluminum alloys (with a silicon content exceeding 30%), which are widely used to manufacture electronic packaging substrates, CPU heat dissipation covers, and power module substrates.
These materials feature a low Coefficient of Thermal Expansion (CTE) that closely matches the silicon chip, minimizing thermal stress and avoiding thermal cycle failure during operation.
Their lightweight properties are highly beneficial for aerospace applications, as they have only one-third the density of copper while maintaining high thermal conductivity and rapid heat export.
The manufacturing process supports molding via powder metallurgy or vacuum hot pressing, which ensures a structure with low porosity and high density.
The silicon (Si) content in the high-silicon aluminum alloys prepared using these raw materials is typically more than 30%.