High-purity tungsten target 300mm W Target
characteristics
Superb film formation quality and stability
The formed film has extremely high thermal stability and chemical inertness, is resistant to high-temperature oxidation, and can operate at temperatures exceeding 1000°C;
The film layer is dense and uniform, with strong adhesion, compatible with various substrates (such as silicon, glass, ceramics, etc.), and not prone to peeling;
Having low resistivity and good thermal conductivity, making it suitable for high-power and high-frequency electronic devices.
Efficient coating process performance
The sputtering rate is high, the process reproducibility is good, and the target material utilization rate is high, making it suitable for large-scale continuous production;
The grain size is small and uniform (usually controlled between 10–40μm), with low surface roughness and few defects;
Exhibits good stability and deposition consistency in processes such as DC magnetron sputtering and HiPIMS.
Wide range of environmental and process adaptability
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Application
Semiconductors and Microelectronics
High Temperature and Protective Coatings
Display and Optical Devices
New Energy and Sensors
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