0102030405
Si Al Slug
Electronic Packaging and Thermal Management Materials
Core application: As a raw material for high-silicon aluminum alloys (such as Si content of more than 30%), it is used to prepare electronic packaging substrates, CPU heat dissipation covers, and power module substrates.
Performance advantages: low CTE matching silicon chip to avoid thermal cycle failure; High thermal conductivity and rapid heat export; Lightweight (only 1/3 the density of copper) for aerospace electronics systems.
Process support: Molding by powder metallurgy or vacuum hot pressing to ensure low porosity and high density.
Surface Engineering and Functional Coatings
Core application: high-purity Si Al Slug (4N~6N grade) sputtering target for optical and semiconductor coating.
Typical products: SiO₂/Si₃N₄ film: used in LOW-E energy-saving glass, AR transparency-enhancing optical devices; Semiconductor barrier layer: used as a diffusion barrier layer for copper interconnects in wafer fabrication; Display panel: TFT-LCD electrode and touch screen conductive layer.
Process requirements: The target should meet the purity > 99.9%, the oxygen content ≤ 6000 ppm, and the density ≥ 2.2 g/cm³.
Wear-resistant alloys and structural materials
Core application: added to cast aluminum-silicon melt as a master alloy to improve the wear resistance of mechanical components.
Typical parts: automotive pistons, brake discs, gearboxes (gravity casting process).
Scientific Research and Emerging Fields
Nuclear radiation shielding: high-density aluminum-silicon alloy replaces lead-based materials, which is environmentally friendly and corrosion-resistant.
3D printing raw materials: pre-alloyed powders are used for laser selective melting (SLM) to manufacture complex heat sinks.
Refractory innovation: silicon-aluminum slag synthetic refractory aggregate for nuclear power plant protection structures.
