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High-Purity Alumina Ceramic Targets from China Suppliers | Quality Factory for Advanced Manufacturing Applications

Alumina ceramic targets are high-purity sputtering targets composed of alumina (Al₂O₃) with a purity level of 99.9% or higher. Manufactured through advanced powder metallurgy and high-temperature sintering processes, these targets are ideal for physical vapor deposition (PVD) techniques like magnetron sputtering and pulsed laser deposition. Renowned for their exceptional insulating properties, chemical inertness, and outstanding optical performance, alumina ceramic targets play a vital role in various applications, including semiconductor insulation layers, optical coatings, and wear-resistant protections. As a leading factory in China, we pride ourselves on being a reliable supplier, providing high-quality alumina ceramic targets to meet your PVD needs

    Film properties
    High insulation
    The prepared alumina film has extremely high resistivity (>10¹⁴ Ω·cm) and dielectric strength (~10 MV/cm), making it an ideal material for insulation and dielectric layers.
    High hardness and wear resistance
    The extremely high hardness of the film (9 on the Mohs scale, second only to diamond) can significantly enhance the scratch and wear resistance of the device surface.
    Excellent chemical stability
    Extremely resistant to most acids, alkalis, and solvents, with excellent corrosion resistance and stability at high temperatures.
    Sputtering and Film Formation Properties
    High Purity and Consistency
    Ultra-high purity (≥99.9%) and strict composition control ensure stable film performance and avoid electrical or optical defects caused by impurity introduction.
    Dense and uniform film formation
    High target density (≥3.6 g/cm³) and uniform grain size enable high-quality film deposition with low defects and good thickness uniformity (inhomogeneity ≤5%).
    Process stability
    The ceramic structure is stable, not prone to cracking or powder loss during long-term sputtering, and has a long service life.
    Compatibility of Chemistry and Technology
    Excellent thermal stability
    The melting point is extremely high (2054°C), and the prepared films can work in high-temperature environments without degradation.
    Wide Gas Compatibility
    Sputtering in inert gas (Ar), reactive gas (O₂), or mixed gas environments with a wide process window.
    Good Adhesion
    Good adhesion to a wide range of substrates (silicon wafers, glass, metals, etc.) and can be used as a functional or protective layer.
    Frequently Asked Questions
    What are the insulating capabilities of the prepared alumina film?
    The prepared alumina film features high insulation performance, offering an extremely high electrical resistivity of over 10¹⁴ Ω·cm and a dielectric strength of approximately 10 MV/cm. This makes it an ideal material choice for dielectric and insulation layers.
    How does the film enhance surface scratch resistance?
    With a hardness rating of 9 on the Mohs scale (which is second only to diamond), the alumina film provides high hardness and wear resistance, significantly increasing the scratch resistance of device surfaces.
    What ensures the uniformity and quality of the deposited film?
    High target density (≥3.6 g/cm³) and uniform grain size enable dense and uniform film deposition. This minimizes defects and ensures high thickness uniformity with inhomogeneity kept at or below 5%.
    Can the alumina film operate in high-temperature environments?
    Yes. Thanks to its high melting point of 2054°C, the film exhibits excellent thermal stability, allowing it to perform reliably under high-temperature conditions without degradation.
    What types of substrates are compatible with the film?
    The film shows good adhesion compatibility with a wide range of substrates, including silicon wafers, glass, and metals. This allows it to serve effectively as both a functional and a protective layer.