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MoTi alloy target：core material for hard coating
Key Functional Features
Copper diffusion blocking ability: Its core value is that it can effectively block the spread of copper atoms to the surrounding dielectric materials in high-temperature processes, and is a key barrier to maintain the electrical integrity and yield of semiconductor copper interconnect structures.
Excellent electrical conductivity: As a metal alloy barrier layer, its resistivity is much lower than that of compound barriers such as titanium nitride, which helps reduce the RC delay of interconnect wires in integrated circuits.
Adjustable Work Function and Optical Performance: By adjusting the Ti/Mo ratio, the work function can be adjusted within a certain range to meet the specific needs of different optoelectronic devices for matching the energy level of the electrode interface.
Comprehensive Performance of Films
Comprehensive Performance of Films
Interfacial Bonding: The deposited film exhibits strong adhesion to silicon, silica, glass, and various polymer substrates, making it ideal for solving interlayer adhesion problems.
Mechanical properties: The film has both high hardness and good toughness, which can significantly enhance the anti-wear and scratch resistance of the protected workpiece, and extend the service life.
Thermal and chemical stability: The thin film structure is not prone to grain coarsening or phase change in high-temperature environments, and can withstand erosion from various chemical environments, ensuring the reliability of devices under harsh conditions.
Craftsmanship and Sedimentation CharacteristicsHigh Deposition Rate and Efficiency: The optimized alloy composition significantly improves the ion bombardment efficiency during sputtering, resulting in higher deposition rates and material utilization.
Extreme uniformity and low defect film deposition: Thanks to the microstructure of the target with high density (≥ 99.5% theoretical density) and fine grains (typically ≤ 30 μm), high-quality film deposition with highly uniform film thickness distribution (inhomogeneity ≤5%), smooth surface, and very low defect density can be achieved.
Extreme purity, stability and reliability: Ultra-high purity raw materials (≥99.95%) and tightly controlled low gas content (oxygen, nitrogen, etc.) ensure a stable sputtering process, minimize micro-arcing and particle jetting, and reduce film defects.
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Semiconductors and Microelectronics
Copper Interconnect Diffusion Barrier Layer: Used in advanced logic chip and memory chip manufacturing, it forms a nanoscale film between copper conductors and silicon substrates or dielectric layers, effectively preventing copper diffusion and improving chip reliability and performance.
Contact electrode and adhesion layer: In thin-film transistor (TFT) arrays used in display panels (OLED, Micro-LED), it acts as a source/drain electrode or adhesion layer between the electrode and the substrate to improve conductivity and bonding.
Hard and Wear-Resistant Coatings
Aerospace and Energy Sector
High-speed cutting tools: Coated with MoTi-based (such as MoTiN) superhard coatings on the surfaces of drill bits, milling cutters, inserts, etc., which greatly improves their hardness, red hardness, and wear resistance for dry, high-speed cutting.
Precision mold coating: applied to the surface of injection molds and die-casting molds to reduce the friction coefficient, prevent product sticking, and significantly extend the service life of the mold.
Protective coatings for high-temperature components: Applied to high-temperature components such as engine blades and combustion chambers, as components of anti-high-temperature oxidation and thermal barrier coatings.
New energy devices: It can be used as a back-contact electrode material in thin-film solar cells (such as CIGS), with good conductivity and stability.
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