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MoSi alloy target：excellent Film uniformity
Film properties
Low Resistivity: MoSi films have low resistivity, making them suitable for high-performance conductive layer requirements.
High-temperature stability: It can maintain structural stability in high-temperature environments, with strong oxidation resistance, and can maintain its performance in high-temperature processes.
Adhesion: Strong bonding with substrates such as silicon-based, glass, and oxides, suitable as a transitional or functional layer.
Low Resistivity: MoSi films have low resistivity, making them suitable for high-performance conductive layer requirements.
High-temperature stability: It can maintain structural stability in high-temperature environments, with strong oxidation resistance, and can maintain its performance in high-temperature processes.
Good adhesion: Strong bonding with substrates such as silicon-based, glass, and oxides, suitable as a transitional or functional layer.
Chemical and Functional Compatibility
Oxidation and corrosion resistance: Forms a dense SiO₂ protective layer on the surface in high-temperature air, preventing further oxidation.
Etching performance: Compatible with common lithography processes, both dry and wet etching can achieve high-precision graphics.
Adjustable Silicon Content: By adjusting the Mo/Si ratio, it can adapt to the electrical and optical requirements of different application scenarios.
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Semiconductors and Microelectronics
Gate and Interconnect Materials: Used for gate electrodes and local interconnect layers in integrated circuits, especially for high-temperature processes.
Diffusion Barrier Layer: Effectively blocks the diffusion of metal atoms, improving device reliability and longevity.
Efficient sputtering performance
Low Resistivity: MoSi films have low resistivity, making them suitable for high-performance conductive layer requirements.
High-temperature stability: It can maintain structural stability in high-temperature environments, with strong oxidation resistance, and can maintain its performance in high-temperature processes.
Good adhesion: Strong bonding with substrates such as silicon-based, glass, and oxides, suitable as a transitional or functional layer.
Chemical and Functional Compatibility
Oxidation and corrosion resistance: Forms a dense SiO₂ protective layer on the surface in high-temperature air, preventing further oxidation.
Etching performance: Compatible with common lithography processes, both dry and wet etching can achieve high-precision graphics.
Adjustable Silicon Content: By adjusting the Mo/Si ratio, it can adapt to the electrical and optical requirements of different application scenarios.
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