High-Purity Molybdenum Target for Sputter Coating - China Suppliers & Factory Products
Can maintain structural stability in high-temperature sputtering environment (300~800°C) and has strong resistance to thermal deformation.
It still maintains high hardness and creep resistance at high temperatures, ensuring that the target material does not crack or deform during long-term processes.
Good thermal compatibility with silicon and glass substrates, reducing delamination or cracking caused by thermal stress of the film.
Improve sputtering efficiency and reduce process energy consumption.
Quickly conducts sputtering heat to prevent target cracking or droplet splashing caused by local overheating, and ensures the uniformity of the film layer.
High power excitation is required, but the sedimentary film layer is dense and the adhesion is strong.
Reduce porosity and defects during sputtering, improve film purity and compactness.
Achieve fine grain structure through process optimization, reduce sputtering particles, and improve the surface finish of the film layer.
Resistant to most acids, alkalis and process gases (such as O₂, N₂), suitable for reactive sputtering (such as deposited MoO₃, MoN).
Not easy to oxidize at high temperature, maintain the characteristics of high-purity metal film (need to control the oxygen content of the cavity).
It ensures excellent structural stability and prevents thermal deformation even in intense high-temperature sputtering environments ranging from 300°C to 800°C.
This coefficient provides optimal thermal compatibility with silicon and glass substrates, which minimizes film cracking or delamination caused by thermal stress.
High thermal conductivity rapidly disperses local heat, preventing target cracking or droplet splashing caused by localized overheating, which ultimately guarantees a uniform film layer.
By optimizing the process to achieve a fine grain structure, it reduces the generation of sputtering particles and enhances the overall surface finish of the deposited film.
Yes, its high corrosion resistance to most acids, alkalis, and process gases (like O₂ and N₂) makes it ideal for depositing compound layers such as MoO₃ and MoN.