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SiC Grinding Balls:Critical Components for Multi-Industry Applications
Mechanical properties
Extremal Environmental Stability
Ultra-high hardness and wear resistance: The Mohs hardness is ≥ 9.5, second only to diamond, significantly better than metal and oxide ceramics (such as zirconia and alumina), and the wear rate is extremely low under extreme friction conditions.
High compressive strength: It can withstand compressive stress of >2.5 GPa, and is not easy to deform or shatter in high-speed and high-pressure environments.
Extremal Environmental Stability
High temperature resistance: Withstand >1600°C in inert atmosphere and stable up to 1400°C in oxidizing atmosphere, far exceeding metal bearing materials.
Chemical inertness: resistant to strong acids (except hydrofluoric acid), strong alkalis, molten metals and highly corrosive media, and the life is more than 10 times that of stainless steel balls.
Excellent in-plane temperature uniformity: Efficient heat transfer, combined with designs such as dorsal helium cooling, ensures wafer surface temperature uniformity meets advanced process requirements.
Electromagnetism and Special Properties
Semiconductor characteristics: Conductive/insulating types can be customized to meet the needs of static sensitive scenarios.
Radiation resistance: Resistant to high-energy particle irradiation, suitable for nuclear industry and space equipment.
High-Tech Industrial Equipment
Semiconductors and Precision Manufacturing
Applied to the spherical joints of vacuum robotic arms, the drive balls of PVD/CVD equipment, and the balls in wafer transfer guide rails, leveraging chemical inertness and resistance to plasma erosion characteristics, ensures low particle release (surface roughness Ra ≤ 0.01μm) under ultra-clean conditions and addresses issues of thin film contamination and transmission precision failure in semiconductor manufacturing;
In scenarios such as corrosion-resistant pump valve ball cores and fuel cell sealing balls, it withstands corrosion from strong acids/bases/high-temperature media, completely eliminating the risk of sealing failure in chemical and energy equipment.
SiC spheres replace metal balls in high-speed spindle bearings, turbomolecular pump bearings, and precision instrument guides, and increase component life by 3-5 times with ultra-high hardness (Mohs hardness ≥9.5) and high temperature resistance (>1600°C), achieving maintenance-free operation in high-temperature/vacuum environments.
At the same time, as a grinding medium for high-hardness materials (such as tungsten carbide and sapphire), its wear rate is only 1/5 of that of zirconia balls, which significantly improves processing efficiency and precision.
At the same time, as a grinding medium for high-hardness materials (such as tungsten carbide and sapphire), its wear rate is only 1/5 of that of zirconia balls, which significantly improves processing efficiency and precision.
Applied to the spherical joints of vacuum robotic arms, the drive balls of PVD/CVD equipment, and the balls in wafer transfer guide rails, leveraging chemical inertness and resistance to plasma erosion characteristics, ensures low particle release (surface roughness Ra ≤ 0.01μm) under ultra-clean conditions and addresses issues of thin film contamination and transmission precision failure in semiconductor manufacturing;
In scenarios such as corrosion-resistant pump valve ball cores and fuel cell sealing balls, it withstands corrosion from strong acids/bases/high-temperature media, completely eliminating the risk of sealing failure in chemical and energy equipment.